Date / Time
Tuesday, 16 April 2019
8 h 30 min - 17 h 00 min

Place
MiQro Innovation Collaborative Centre

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For beginners and intermediates as scientist, engineer, or technologist in microelectronics field. After this 1-day training, students will understand how a plasma is generated, how it behaves in the plasma reactor (RIE, DRIE), and how it etches material. They will receive key knowledges which they can later apply on their systems to develop a plasma etching recipe by their own. Covered subjects:

1. Plasma Fundamentals
2. Plasma Systems
3. Anisotropic Etching
4. Silicon and Compounds
5. Deep Reactive Ion Etching (DRIE)
6. Other material Etching
7. Profile characterisation
8. End Point Detection

Note: Depending on attendees, the course will be given in english, or in french or both for the convenience of the audience.

Registration here