Service offering
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com
Mission
We are committed to delivering high-quality, cost-effective systems that create value for our customers. In our efforts to achieve this mission, we strive to supply quality products and make the satisfaction of our customers, suppliers and employees a priority.
Competence
RF Circuits
Manufacturers of microwave modules, RF circuits, MEMS, advanced semiconductor packages, multi-chip modules, hybrid devices are the original “core” customers for MRSI products. Hardware and software for chip attachment and platform distribution have been designed around the need for greater precision and repeatability in the assembly of complex microwave and RF assemblies. These systems require the integration of cost-effective RF components, while maintaining the same level of excellent RF characteristics. These millimetric frequencies are increasingly demanding for the new generations of GaAs MMICs, which are only 50 microns thick.
Fixing these MMICs using conductive adhesive is the cheapest approach, but requires a high-performance epoxy dispensing process to control smaller volumes.
High-precision distribution
Today’s PCB manufacturers face challenging applications as product miniaturization, power, circuit frequency and complexity increase. Shorter production cycles minimize the time available for volume production. Advanced encapsulation for microwaves, hybrids, MEMS and photonics is considered one of the most challenging applications.
Progress in the automated distribution of conductive epoxy resin has enabled the microelectronics industry to take greater advantage of automation, even though products have become more difficult to produce. The manufacturing of microelectronic circuits is typical of the extreme control required for state-of-the-art packaging. The main concern of design engineers is the epoxy control process. Complete coverage without micturition is important to maximize heat transfer and minimize stress. Automated equipment must be capable of all this, while being fast, reliable and reproducible.
The MRSI-175Ag can be configured with multiple pumps or a mix of pumps, jets and stamping tools. Two different pumps can be used for two different epoxy resins simultaneously. Or a pump and cutting tool with a tool changer can be used to dispense one epoxy and the small dot seal and a second epoxy. Ultimately, when pumps and stamping tools are attached to a common support and can be quickly modified during operation, the best possible flexibility is achieved.
Skills
System design
Softwares
Vision equipement
Motion control
Industrial automation
High precision
Thermal and various methods of fastening
