Manufacturing and Processing of Wafers from Glass, Quartz, Glass-Silicon compounds and glass like materials. Sales of blank borosilicate and quartz wafers off the shelf. Mainly manufacturing of wafers according to customer specification. Patterning of wafers using different technolgoies as CNC, microblasting, eching or laser ablation.
Glass wafers to be used in MEMS & Sensor Technology as substrates or packaging wafers as well as Carrier Wafers for thin wafer handling in Semiconductor manufacturing.
Plan Optik AG is the leading manufacturer of patterned wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter and are used for manufacturing or encapsulation of MEMS and Sensors as well as Carrier wafers that enable handling of thin Semiconductor wafers.
Manufacturing and Processing of Wafers from Glass, Quartz and Glass-Silicon compound. Mechanical processing for wafers from raw material to blank and patterned wafers (Ingot-sawing, CNC, Edge Processing,Grinding, Polishing, microblasting, etching, laser processing). Optical (AR, ITO and alike) and basic metal (Cu, Ti) coatings.
Manufacturing of Carrier wafers for thin wafer handling with laser-, thermal- or chemical release.