Publications

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*Following texts are only available in french.

*Following texts are only available in english.

2014-12 TECHNICAL THERMAL DESORPTION
2014-11 THERMAL ANALYSIS – TMA – DMA
2014-10 THERMAL ANALYSIS – DSC – TGA
2014-09 PLASMA-FIB
2014-08 THERMOIRÉ
2014-07 ION MILLING
2014-05 TDR TECHNIQUE
2014-04 X-RAY TOMOGRAPHY

EFFECTIVE METHOD FOR WIRE BONDS REWORK USING

CONDUCTIVE EPOXY

Interesting article wrote by two scientists from the C2MI: Catherine Marsan-Loyer and Thomas Dequivre.

The development of wire bonded chips requires to go through multiple designs to achieve the best packaging performances.

Nevertheless, some of the designs may not be tested due to defects preventing the wire bonds to be effectively completed. Unless an effective way to rework such failed assemblies is feasible, the invested resources in the design and manufacture are lost. The MiQro Innovation Collaborative Centre(C2MI) has developed a method to rework such assemblies.

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