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*Following texts are only available in french.
2018-06 SPECTROSCOPIE INFRAROUGE À TRANSFORMÉE DE FOURIER (FT-IR)
2018-05 XPS: PROFIL EN PROFONDEUR PAR PULVÉRISATION IONIQUE
2018-04 LA PRÉPARATION D’ÉCHANTILLONS MÉTALLOGRAPHIQUES
2018-03 MICROSCOPE CONFOCAL À BALAYAGE LASER
2018-01 BOND TESTER
*Following texts are only available in english.
Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect – Catherine Marsan-Loyer
Effective Method for Wire Bonds Rework using Conductive Epoxy – Thomas Dequivre and Catherine Marsan-Loyer
EFFECTIVE METHOD FOR WIRE BONDS REWORK USING
Interesting article wrote by two scientists from the C2MI: Catherine Marsan-Loyer and Thomas Dequivre.
The development of wire bonded chips requires to go through multiple designs to achieve the best packaging performances.
Nevertheless, some of the designs may not be tested due to defects preventing the wire bonds to be effectively completed. Unless an effective way to rework such failed assemblies is feasible, the invested resources in the design and manufacture are lost. The MiQro Innovation Collaborative Centre(C2MI) has developed a method to rework such assemblies.
Lear more here