OUR DEVELOPMENT TEAM
C2MI is the largest center for research and innovation in microelectronics in Canada. Offering state-of-the-art equipment dedicated mainly to advanced microchip encapsulation and microelectromechanical systems (MEMS), the Center also brings together more than 250 scientists in research and development (R & D).
OUR BUSINESS DEVELOPEMENT TEAM
Our business development team will quickly understand all aspects of your needs. Curiosity, dynamism, and rigor, in addition to technical expertise and industrial experience, are the distinctive strengths of our highly efficient business development team.
OUR TECHNICAL TEAM
Top row: Pascal Boivin, Thomas Dequivre, Dominique Langlois-Demers, Marie-Josée Turgeon, Alan Renaudin, Marc-André Joncas, Dominic Carrier, Irina Stateikina, Karel Côté, Nadeesh Nobeen and Catherine Marsan-Loyer
Our technical team has over 250 years of experience in the field together.
Regardless of the nature, the sector or the market segment for which you are looking for an innovative solution, our team of scientists in R & D of products and processes is there to accompany you at every step of the realization according to your needs. They are also able to identify internal or external collaborators who will be able to join your project to collaborate on the development of your technology products which will make you stand out in your market segment.
C2MI’s labs have several highly specialized equipment for assembling semiconductors on a substrate or on an electronic board to make it ready for assembly. The C2MI’s facilities allow thinning and cutting of 200mm and 300mm wafers, reverse chip and solder assembly or bonding and component micro cabling with positioning accuracy of up to 1 micron for all types of integrated circuit components or optoelectronics.
The C2MI MEMS laboratory has class 10 and class 1 clean rooms on the surface of the slices. The infrastructure is suitable for the micro-machining of surface layer as well as for silicon. The C2MI features 300mm production lines for first-level assembly as well as fabrication and encapsulation of MEMS on 200mm slices.