Mr. Jean-Marc Papillon has joined Semtech Corporation, formerly Gennum Corporation, in 2011. As director of R&D packaging engineering, he is in charge of 3D modeling, design and process development associated to novel package and wafer-level technologies for the Signal Integrity Group.
He began his career in 1991 at IBM Bromont, where he worked for nine years as Manufacturing Engineer in assembly process development and equipment automation. He then joined AMCC (now AppliedMicro) at the San Diego, CA head office for seven years where he launched several new packages and foundry technologies, as well as taking the lead of the corporate product quality, reliability and failure analysis organization. In 2007, he joined Neterion, a SFP+ network adapter supplier, in Cupertino and later in Ottawa, leading over a period of four years a world-wide team in charge of product engineering, manufacturing and quality.
Mr. Papillon has authored three patents related to high-speed package design and manufacturing. He holds a Bachelor and a Master in Mechanical Engineering from the University of Sherbrooke. He is a member of the Ordre des Ingénieurs du Québec.