PUBLICATIONS
â LEARN MORE ABOUT C2MI Â â
*Following texts are only available in french.
2019-06 HESSE MECHATRONICS BJ653 – THIN / HEAVY WIRE AND RIBBON BONDER
2018-06 SPECTROSCOPIE INFRAROUGE Ă TRANSFORMĂE DE FOURIER (FT-IR)
2018-05 XPS: PROFIL EN PROFONDEUR PAR PULVĂRISATION IONIQUE
2018-04 LA PRĂPARATION D’ĂCHANTILLONS MĂTALLOGRAPHIQUES
2018-03 MICROSCOPE CONFOCAL Ă BALAYAGE LASER
2018-02Â TD-GC/MS
2018-01 BOND TESTER
*Following texts are only available in english.
2015-05 FAILURE ANALYSES
2015-04 LABORATORY ANALYZES
2015-03 X-RAY PHOTOELECTRON SPECTROSCOPY – XPS
2015-02 FTIR TECHNIQUE
2015-01 ACOUSTIC IMAGING – CSCAN
2014-12 TECHNICAL THERMAL DESORPTION
2014-11 THERMAL ANALYSIS – TMA – DMA
2014-10 THERMAL ANALYSIS – DSC – TGA
2014-09 PLASMA-FIB
2014-08 THERMOIRĂ
2014-07 ION MILLING
2014-05 TDR TECHNIQUE
2014-04 X-RAY TOMOGRAPHY
2019-09Â VACUUM-ASSISTED WET PROCESSING IN MEMS MICROFABRICATION
2019-02 : H2 ANNEAL FOR SIDEWALL ROUGNESS REDUCTION IN INDUSTRIAL SETTING FOR MEMS MICROFABRICATION
Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect
Effective Method for Wire Bonds Rework using Conductive Epoxy
https://www.c2mi.ca/wp-content/uploads/2019/02/White-paper_H2_Anneal_V02.pdf
2019-2020 Highlights reportÂ
2018-2019 Highlights report
2017-2018 Highlights report
2016-2017 Highlights report
2015-2016 Highlights report
2014-2015 Highlights report
2013-2014 Highlights report
2012-2013 Highlights report
DID YOU KNOW... ?
Did you know that wire bonding, although invented over 60 years ago, still requires manual threading of its automated tools? In […]
Did you know that there is another method for flip chip attach than the traditional C4 controlled collapse chip connection? […]
In fact, cleaning methods which require no water nor solvents are well indicated for the sensitive microelectronic devices. Plasma cleaning […]
Printed electronics is becoming very popular in the market because of its economic and ecological advantages among other things. Imagine […]
Did you know that devices barely bigger than the diameter of a hair could save your life? Indeed, the technology […]
Did you know that knitting is also being practiced in microelectronics? Indeed, the technique of “wirebonding” is a technique that […]
The ancestor of the 3D vision glasses that allow us to see through the walls already exists! A much larger […]
Water, although it is perceived as a hostile environment for electronics and from which, intuitively, we try to keep everything […]
Intermittent electrical problems are present in our daily lives, whether it is our automobile on which a headlight turns off […]
As for bridge structure where we circulate all day long, electronic components distort itself with temperature, especially electronic board. Indeed, […]
On April 11, C2MI will held the Technical conference on printed electronics and 3D printing. For more information, go on […]
The C2MI has recently acquired the new capability of doing capillary wedge-to-wedge wire bonding on its K&S Iconn PoCu Plus […]
The tasting profession is far less dangerous today than it was in the Romans, and not only because poisons are […]
QuĂ©becInnove is a network recognized by the Government of QuĂ©bec. It brings together active organizations in research and innovation that can meet […]
C2MI’s material analysis laboratory is made up of state-of-the-art equipment that allows you to literally find a grain of salt […]
Teledyne Dalsa Semiconductor manufactured the CCD image sensors for the Mars mission by NASA prepared either for «Spirit» and «Opportunity» robots.
In the past, reliability was dictated by the 5 min rule: when a cathedral was built, the workers removed the […]