PUBLICATIONS
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*Texts are only available in english.
2019-06 HESSE MECHATRONICS BJ653 – THIN / HEAVY WIRE AND RIBBON BONDER
2018-06 SPECTROSCOPIE INFRAROUGE À TRANSFORMÉE DE FOURIER (FT-IR)
2018-05 XPS: PROFIL EN PROFONDEUR PAR PULVÉRISATION IONIQUE
2018-04 LA PRÉPARATION D’ÉCHANTILLONS MÉTALLOGRAPHIQUES
2018-03 MICROSCOPE CONFOCAL À BALAYAGE LASER
2018-02 TD-GC/MS
2018-01 BOND TESTER
*Les textes suivants sont seulement disponibles en anglais.
2015-05 FAILURE ANALYSES
2015-04 LABORATORY ANALYZES
2015-03 X-RAY PHOTOELECTRON SPECTROSCOPY – XPS
2015-02 FTIR TECHNIQUE
2015-01 ACOUSTIC IMAGING – CSCAN
2014-12 TECHNICAL THERMAL DESORPTION
2014-11 THERMAL ANALYSIS – TMA – DMA
2014-10 THERMAL ANALYSIS – DSC – TGA
2014-09 PLASMA-FIB
2014-08 THERMOIRÉ
2014-07 ION MILLING
2014-05 TDR TECHNIQUE
2014- 04 X-RAY TOMOGRAPHY
2019-09 VACUUM-ASSISTED WET PROCESSING IN MEMS MICROFABRICATION
2019-02 : H2 ANNEAL FOR SIDEWALL ROUGNESS REDUCTION IN INDUSTRIAL SETTING FOR MEMS MICROFABRICATION
Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect
Effective Method for Wire Bonds Rework using Conductive Epoxy
https://www.c2mi.ca/wp-content/uploads/2019/02/White-paper_H2_Anneal_V02.pdf
2019-2020 Highlights report
2018-2019 Highlights report
2017-2018 Highlights report
2016-2017 Highlights report
2015-2016 Highlights report
2014-2015 Highlights report
2013-2014 Highlights report
2012-2013 Highlights report
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