PACKAGING ASSEMBLY LABORATORY
C2MI offers a wide range of equipment to conduct the advanced packaging of semiconductors as a finished product on a substrate ready for assembly to the card. The integrated circuit (IC), also called electronic chip is an electronic component reproducing one or more electronic function more or less complex, often incorporating several basic types of electronic components in a small volume, making it easy to circuit work. There is a wide variety of these components divided into two categories: analog and digital.
A chip is a small piece of semiconductor on which an electronic integrated circuit was manufactured. The chips are obtained by cutting semiconductor wafers on which is this electronic circuit obtained by a succession of steps of photolithography, ion implants, thin film deposition or even more electronic circuits.
The term “chip” is used when the manufacturing process is completed and which has been performed the cutting of the semiconductor wafer.
The bearings (connection with a solder alloy on a plot) are at the heart of the chip connection technologies reversed (flip chip). The electrical connection between the chip and the substrate on which they are assemble is provided by the presence of a conductive microbead on a layer called UBM (Under Bump Metallurgy) that bridges the microbead and the semiconductor circuit. The “Flip Chip” assembly method is therefore to assemble this chip with microbeads on a substrate from a positioning method and a temperature cycle carefully controlled. The assembly recipe is influenced by many settings and components (the UBM, the solder alloy, the kind of substrate, etc.).
The assembly technique of the binding thread (wirebond) is the method of making interconnections usually used between an integrated circuit (IC) and another device which serves as a support. The wire bonding technique is generally regarded as the most cost effective and flexible interconnect technology, and is still used today to assemble the vast majority of semiconductor devices.