CAPABILITY:

High power applications that require heat dissipation during test

Chamber less, conductive thermal design

ATC: Active Thermal Control temp range -45°C to +110°C

SHP: Passive Thermal Control range -10°C to +110°C

Up to 500W active power dissipation

Power densities up to 100 Watts/cm2

Dual Test Site Parallelism

Dry and Liquid Package Thermal Interface

7 automated bins (13″ stack)

Lidded or Bare Die Packages, BGA, LGA, PGA, MCM, etc

Package size: 10 mm sq up to 70 mm sq

JEDEC trays input/output

2D Vision Code reader