Our DW-3000 maskless aligner achieves a throughput of >30 wafers per hour (1 laser head). Since the tool do not use physical masks, it has high flexibility, handling single wafer to mass production processes. It can also compensate for global and local distortions on wafers in real time and also allow to add complete traceability on each dies (lot#, wafer #, die#…).
Screen uses the laser control technology that it has developed over many years to expose high-power laser beams at high precision onto the GLV™. This enables an impressive 8,000 laser beam channels to be controlled simultaneously. As a result, synchronization with a high-speed stage is possible, achieving high-speed, high-precision imaging. This technology allow this tool to be the first “production capable thoughput” maskless technology on the market.

Spécifications:
Resolution 3 μm (L/S)
Exposure method Direct imaging (raster scanning method)
Reduction ratio 1:10
NA (numerical aperture) 0.1
Exposure light source 16 W YAG laser (near i-line:355 nm)
Wafer size 200 mm
Overlay accuracy Top surface alignment : ≤ 1 μm (|M| + 3 σ)
Back side alignment (InfraRed) : ≤ 1 μm (|M| + 3 σ)

This acquisition was made possible with the contribution of: