Reliability laboratory / Environmental stressing / Deep thermal cycling (DTC, TS)
Thermal Shock Chambers ETS13-SSW
Supplier :
Model :
Purpose :
Determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes
CAPABILITY:
Meets Jedec temperature cycling specifications JESD22-A104
Temperature recordings with data logging
Temperature range from -77°C to 180°C in two different chambers (hot and cold)
Elevator transferring parts in both hot and cold zones after a given time
Maximum chamber dimensions 28x24x33 inches ( W,D,H)
Typical rise time -55 to 125C, 5 min , 2 cycles/ hour ( thermal mass dependant)
Available tests : DTC, TS, others on demand
