Packaging assembly laboratory / Component placement / Chip placement
Fineplacer Femto Die Bonder
Supplier :
Model :
Purpose :
Fully automated bonder for positioning and attaching small electronic or opto-electronic components on printed circuit board or substrate.
CAPABILITY:
Ideal for product and process development
Placement, thermo compression bonding capable
Forming gas and formic acid available
Automated pattern recognition, alignment and bonding
Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
Live process observation camera
Placement accuracy: 0.5 µm
Field of view: 0.27 mm x 0.2 mm (min) 3.2 mm x 2.4 mm (max)
Component size: 0.125 mm x 0.125 mm (min) 80 mm x 80 mm (max)
Working area: 450 mm x 150 mm (max)
Z travel / resolution: 10 mm / 0.2 µm
Y travel / resolution: 150 mm / 0.1 µm
X travel / resolution: 450 mm / 0.1 µm
Theta travel +/- 9˚ / resolution; 0.2 m˚
Bonding force max : 500 N
Heating temperature max : 450 ˚C
