Underfill for flip chip and chip scale packaging

Chip encapsulation

Dam and fill

Thermal compounds

Exterior bulk fluid reservoir

Tactile height sensor

Programmable fluid and valve pressure control

Digital vision system

X-Y placement accuracy : ±0.050 mm @ 3 sigma

Z repeatability : ±0.025 mm

X-Y repeatability : ±0.025 mm

Dispense area : 339 x 410 mm

Camera’s field of view: 7.0 x 5.0 mm