Nordson Dage 4000 Plus

Nordson Dage 4000 Plus

Packaging assembly laboratory / Inspection / Ball pull

Nordson Dage 4000 Plus

Supplier :

Model :

Purpose :

Testing of bonds, solder joints, wires and substrate material in the semiconductor and electronic manufacturing industry

CAPABILITY:

Pull

Cold bump pull (200µm, to 750µm ball diameter)

Sample size:  10 mm to 100 mm

Cartridge: Up  to 5 Kg load

Speed:  Up to 5 mm/sec

Shear

Ball shear

Sample size:   10 mm to 100 mm

Cartridge: Up to 5Kg

Speed:  Up to  1mm/sec

Results

Display: Profile , Histogram, Trend, Pareto, Statistics

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