Analytical laboratory / Microsectioning / Sample preparation (mechanical)
Struers, Buehler, ATM, Leco, Allied High Tech, SBT
Supplier :
Model :
Purpose :
Cutting, mounting, grinding & polishing micro electronic parts for characterisation and/or failure analysis.
CAPABILITY:
Cutting
Rough cutting max sample size :50 X 50 cm
Precision cutting : 160 X 50 mm / 70 mm Dia.
Low speed : max dia. 30 mm
Wire saw : 45 X 45 X 20 mm (max. sample size)
Mounting
Cold mounting
clear epoxy 8 hour cure room temp. (very low shrinkage)
Acrylic 10 min. cure room temp.
Grinding / polishing (wet or dry) up to 12 inches platen
Grinding
Maxi sample size: 3 inches Ø or 3 inches x 4 inches rectangular, 2 inches high
SiC, diamond, diamond Lapping film, (wet or dry)
Back side delayering
Precision grinding
High removal rate
Polishing
Diamond , Al2O3, Colloidal silica, lapping film
Automatic preparation
Precision down to 1µm (small sample size)
Large sample size (special tooling may be required)
