|Plan Optik AG, the leading manufacturer of wafers from glass and quartz for Semiconductor and MEMS applications, is proud to announce its collaboration with the Centre de Collaboration MiQro Innovation (C2MI) in Bromont, Canada. |
After successfully working with C2MI and members of their company network in the past years Plan Optik AG will from now on also participate in C2MI network activities. Joining this network will enable Plan Optik to share their experience and Know-how to members, partners and companies beyond. As a member Plan Optik will provide manufacturing service for other members, partners and other companies in order to thrive innovations and decrease the time from prototype to product manufacturing of new technologies.
“The C2MI is an international beacon in advanced packaging and microsystems. As a Centre of Excellence, its goal is to allow its members to foster the growth of the microelectronics industry through the accelerated commercialization of market-driven prototypes. Active and seamless collaboration and synergy among the Center’s members enables the rapid commercialization of next-generation prototypes.” (from C2MI Homepage)
|Carrier Wafer – a useful and necessary tool for MEMS and Sensor Packaging|
Smaller package sizes require extremely thin substrates to build up devices. Those thin and ultra-thin substrates also enable 3D packaging of sensors such as complementary metal-oxide-semiconductor (CMOS) image sensors and others. Producing thin wafers in high quantities puts challenging requirements on handling and processing tools.
|Plan Optik expands its range of stock wafer|
Plan Optik AG expands its range of products which are available off the shelf to feature new materials! Additionally Plan Optik releases a product catalogue including all stock products with detailed information and specification!
|Carriers for mechanical release – Thin wafer handling|
Due to their low thickness, semiconductor wafers are vulnerable to stress and breakage. Warping of the wafers during handling and processing causes a high yield loss or even makes it impossible to handle the wafers any more. This means, a Thin wafer handling technology with a high grade of flexibility on wafer and substrate sizes is needed.
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