CAPABILITY:

Wafer size: 200 mm

Thickness range of wafers: 300 – 1200 µm

Wafer material: Silicon, Glass

Fully qualified for through silicon via AquiViaTM process under license from Alchimer, with the following modules:

• Module 1: Pre-wetting of Si wafers with 20:1 aspect ratio vias
• Module 2: Chemical grafting of 0.2-1.0 µm insulation film
• Module 3: Activation of insulation for Ni(B)
• Module 4: Electroless Ni(B) diffusion barrier
• Module 5: Cu electrofill in 50:5µm & 100:5µm TSV
• Module 6: Wafer annealing
• Module 7: 80Au/20Sn eutectic electroplating