CAPABILITY:

Wafer size: 200 mm

Thickness range of wafers: 300 – 1400 µm

Wafer material: Silicon, Glass, Bonded wafers, Perforated wafers

Transfer wafers between SMIFs and Open cassettes

Sort wafers in ascending/descending order

Notch alignment within ±0.1 °

Flip wafers

Prevent frontside and backside particle contamination