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Kulicke & Soffa Maxum
Supplier :
Model :
Purpose :
Electrical connection between the chip and the substrate via gold wire
CAPABILITY:
Fully automatic wire bonder
Cassette in/out
Typical ultra-fine pitch ball grid array product
45µm pad pitch
65 msec wire cycle time
Minimum 0.8 mils Ø gold wire
Transducer 14-25 Ohms impedance
Frequency 113-115 KHz
Wire pull and ball shear available for process development/control
