CAPABILITY:

High speed, uniform plasma cleaner

Parallel plate RF back-sputtering method

O₂ (option Ar)

High frequency power source 100 W to 600 W  (13.56 MHz)

Diaphragm vacuum gauge, 266 Pa full scale

Rotary pump exhausting speed 345 L/min (60 Hz)

Mass flow controller Ar gas 2.5ml/min to 10 ml/min

O₂ gas 10ml/min to 100 ml/min

Ultimate vacuum  less than 3 Pa

Board dimension length    : min 50 mm / max 330mm

Width   : min 20 mm / max 120mm

Thickness: min 0.5mm / max 2.0 mm

Magazine dimensions :  Length : min 100mm / max 350mm

•     Width :  min 25mm / max 125mm
•     Thickness: min 70mm / max 240mm
•     Etching rate:O₂ plasma average 420 nm/min

Distribution +/- 30% or less

Cleaning area 10 mm inside board perimeter