The PacTech SB²-Jet is a high-precision automated platform dedicated to sequential solder ball placement using laser solder jetting technology.

Compatible with chips, wafers, PCBs and other substrates, it enables the placement of solder balls ranging from 40 to 760 µm in diameter. Its selective, contactless placement capability, requiring no dedicated tooling, provides exceptional flexibility for complex geometries and new product development.

Particularly well suited for R&D and advanced prototyping environments, where device diversity and frequent process changes are the norm, the platform can efficiently support a wide range of technologies and form factors without the need for dedicated masks or stencils. Its highly versatile placement approach makes it ideal for rapid design iterations, low-volume production, and process development activities. The SB²-Jet also supports multiple solder alloys, including AuSn, SAC, and InSn, addressing advanced assembly requirements in microelectronics, MEMS, optoelectronics, 3D packaging, and quantum technologies.