CAPABILITY: Machine and process alignment capability ≥2 Cpk +/- 12.5 µm, 6 sigma Max print area 510 mm (X) x
CAPABILITY: Wafer size: 200 mm Thickness range of wafers: 300 – 1400 µm Wafer material: Silicon, Glass, Bonded wafers, Perforated
CAPABILITY: Machine and process alignment capability ≥2 Cpk +/- 12.5 µm, 6 sigma Max print area 510 mm (X) x
CAPABILITY: Wafer size: 200 mm Thickness range of wafers: 300 – 1400 µm Wafer material: Silicon, Glass, Bonded wafers, Perforated