APPLICATIONS FIELD:

• Laser to wafer integration (III-V dies to Si photonic wafer)
• High accuracy die attach (Passive lense placement)
• Local and fast local eutectic reflow ( HAZ < 1mm²)

SPECIFICATIONS:

• Supports ± 0.2µm @ 3s placement accuracy
• Supports Die Attach and Flip Chip applications on wafer or single dies
• PID on placement accuracy to stabilize process drift
• Quantitative Parallelism Calibration
• In-situ Eutectic Bonding Capability
• Epoxy dispending (Time pressure & Jetting)
• UV Curing capability at the Bond Station
• Active bond force control from 0.1 to 20N