CAPABILITY :    

Applications field : 

• Laser to wafer integration (III-V dies to Si photonic wafer) 
• High accuracy die attach (Passive lense placement) 
• Local and fast local eutectic reflow ( HAZ < 1mm²) 

Specifications 

• Supports ± 0.2µm @ 3s placement accuracy 
• Supports Die Attach and Flip Chip applications on wafer or single dies 
• PID on placement accuracy to stabilize process drift 
• Quantitative Parallelism Calibration 
• In-situ Eutectic Bonding Capability 
• Epoxy dispending (Time pressure & Jetting) 
• UV Curing capability at the Bond Station 
• Active bond force control from 0.1 to 20N