CAPABILITY:

The B&G decapsulator is capable of using either fuming nitric or sulfuric acid. Fuming nitric acid is the most commonly used etchant. It operates at low temperature, cleanly exposing the die without attacking the bond pad metallisation.

Certain encapsulant material being used today cannot be etched with fuming nitric acid. In these cases, sulfuric acid is the best choice . Because its high operating temperature, sulfuric acid is effective at removing almost all commonly used encapsulant.