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BOSCHMAN Unistar Innovate-2-FF
Supplier :
Model :
Purpose :
Transfer molding compound to protect/encapsulate semiconductor chips
CAPABILITY:
Multi plunger molding system
Molding press with fully automatic control and transfer
Manual lead frame/strip/singulated parts and pellet handling
Auto process control
Automatic and fully integrated film handling units for FAM technology
Mold surface and mold inserts (if required) are molded flash and bleed free
Film handlers (winders) for fresh and used film
Film handler for top and bottom mold for 2 strips molding
Universal test mold base
Small, low cost mold inserts available for inexpensive process trial run
Cavity vacuum unit for substrate based flip chip packages
Plunger speed is free programmable between 0.1-10 mm/sec
Plunger speed accuracy +/- 10%
Programmable cure pressure
Mold clamping system is adjustable between 10-50 tons
Mold temperature is within +/- 3˚C of pre-set point
Soft close of the mold to prevent damage to the mold
Horizontal pellet loading
Pellet preheat time is free programmable