CAPABILITY:

JEDEC tray input/output

Accuracy +/- 10 µm @ 3 sigma,  cpk 1.33

Theta axis rotary bond head 0˚ to 360˚  increments 0.0045˚

Theta placement accuracy +/- 0.15˚ @ 3 sigma

Automatic calibration function corrects thermal changes over time

Multi-chip placement in one single pass capability

Picking from  wafer ( 4 to 12 in.) on 12 in. frame

(Or waffle pack / GEL PAK ( 2 x 2 in.)

Wafer table with stretcher

7 positions automatic tool changer unit

SECs/GEM capability

Wafer scanner  and electronic wafer mapping capable

Pattern recognition system with edge, gray level, pattern and ink dot

Wafer size  50 to 300 mm

Frame size 375 mm

Die size  0.5 mm to 50 mm

Die thickness  0.05 to 7 mm