CAPABILITY:

• Applications field:
  • Wafer-level measurement of thickness, TTV, bow, and warp
  • Optical profiler for measuring step height and CDs.
  • Thickness measurements on transparent and semi-transparent films.

• Flexible development with high accuracy:
  • Alignment camera with automatic pattern recognition for repeatable location of measurements.
  • Can be used for wafers up to 300mm, down to single dies.
  • Samples are placed between a pair of sensors aligned for simultaneous thickness measurements.
  • Wafers are supported by 3 contact points, no vacuum.
  • Equipped with chromatic white light sensors having a vertical resolution down to 30nm, and a measurement range up to 3 mm.
  • Equipped with a thin film reflectometry sensor for measuring thickness of transparent and semi-transparent films between 0.1µm and 100µm (wavelength 205 nm – 1079 nm).