Packaging assembly laboratory / Wirebond assembly / Discrete component placement
Iconn ProCu Plus LA
Supplier :
Model :
Purpose :
Make the electric connexion between the chip and the substratum with a gold or a copper wire.
CAPABILITY:
Fully automatic wire bonder
Cassette in/out
Typical ultra-fine pitch ball grid array product
35µm minimum pad pitch
2µm @ 3 sigma accuracy
Minimum 0.6 mils Ø wire
Extra large 56mm X 87mm bond area
Copper wire option with forming gas
Advanced node wafers down to 28nm or below
Wire pull and ball shear available for process development/control
