CAPABILITY:

Jedec tray input output ( 1 input / 3 output)

Substrate or component size 4 x4 mm up to 68.5 x 68.5 mm

2D/3D bump inspection

Component laser or ink marking inspection

Staggered grid layout inspection

BGA and LGA inpection

Component thickness inspection available 2.7 mm to 3.7 mm

Minimum bump size unflattened 70 µm

Minimum bump size flattened 60 µm

Ball presence/absence, , extra ball detected

Reporting for each parameter LSL, NML, USL, min, avg, 3 sigma CP, CPk