Integrated microsystems laboratory (MEMS) / Dry etching / Release Etch
Primaxx fxP
Supplier :
Model :
Purpose :
Anhydrous VHF etch of sacrificial oxide in Monarch 25 module and XeF2 etch of a sacrificial silicon
Primaxx fxP
(VHF)
- Batch processing module (up to 25 200 mm wafers)
- Oxide etch rates: 0.1 à 10 um/min
- Oxide etch uniformity within wafer: ≤ 7%
- Oxide etch repeatability: ≤ 4%
- Selectivity to silicon > 10 000 : 1
- Process with high selectivity to silicon nitride is available
Xactix CVE
(XeF2)
- Single wafer processing module.
- Silicon etch rate : 0.1 à 10 um/min
- Silicon etch uniformity within wafer:: ≤12%
- Silicon etch repeatability: ≤ 5%
- Selectivity to oxide > 10 000 : 1
- Process with high selectivity to silicon nitride is available
