Hesse Mechatronics BJ653

Hesse Mechatronics BJ653

Packaging assembly laboratory / Wirebond assembly / Wire bond

Hesse Mechatronics BJ653

Supplier :

Model :

Purpose :

Electrical connection between the chip and the substrate via gold or aluminum thin wire/ribbon or heavy aluminum round wire.

CAPACITY:

Automatic mode

Working area (x, y, z) : 100 x 115 x 42 mm

Axis accuracy : ±10 µm

Heated working area up to 200°C

Bond head rotation : 440°

DA07 bond head : thin wire, deep access

  • Round wire Au, Al : 17.5µm – 50µm
  • Ribbon Au, Al : 6×35µm – 25×250µm
  • 2 inch spools

HBK10 bond head : heavy round wire

  • Round wire Al : 50µm – 500µm
  • 2-8 inch spools

Ebox option included

Field of view : 6×8 mm

To obtain more information about this equipment, email us !

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