Packaging assembly laboratory / Wafer Dicing / Manipulation
Royce Instruments MP300
Supplier :
Model :
Purpose :
Removed die from dicing tape and place in 2 inches bank
CAPABILITY:
Electronic wafer map
Conversion to make software compatible with ALPS
wafer map
Wafer expending film frame or ring holder up to 12 inches
Up to 16 x 2 inches (50mm) waffle pack or Gel-Paks
Quad needle eject head, up to 3 mm eject height
Die size from approx. 0.76 – 25.6 mm square
Standard soft surface contact vacuum pick up
Non surface contact mechanized die pick and place system
