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Royce Instruments MP300

Packaging assembly laboratory / Wafer Dicing / Manipulation

Royce Instruments MP300

Supplier :

Model :

Purpose :

Removed die from dicing tape and place in 2 inches bank

CAPABILITY:

Electronic wafer map

Conversion to make software compatible with ALPS

wafer map

Wafer expending film frame or ring holder up to 12 inches

Up to 16 x  2 inches (50mm)  waffle pack or Gel-Paks

Quad needle eject head, up to 3 mm eject height

Die size from approx.  0.76 – 25.6 mm square

Standard soft surface contact vacuum pick up

Non surface contact mechanized die pick and place system

To obtain more information about this equipment, email us !

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