Packaging assembly laboratory / Wafer Dicing / Wafer Dicing
Tape Expander UH130
Supplier :
Ultron
Model :
UH130
Purpose :
Post laser dicing tape expansion.
CAPACITY:
200mm wafers
Pneumatic ram with speed control and 3″ adjustable stroke
Motorized circular cutter assembly
Digital temperature-controlled heated stage with thermistor
Grip Ring Adapter for various wafer / grip ring sizes
