Packaging assembly laboratory / Wafer Dicing / Tape Expander Tape Expander UH130 Supplier : Ultron Model : UH130 Purpose : Post laser dicing tape expansion. CAPACITY: 200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage with thermistor Grip Ring Adapter for various wafer / grip ring sizes