Packaging assembly laboratory / Wafer Dicing / Stealth Dicer
Stealth Dicer Disco DFL7340
Silicon wafer laser dicing.
CAPACITY:
Fully automated mode
200mm wafers
X-axis :
- Feeding speed : 1.0 – 1000 mm/s
Y-axis :
- Index step : 0.1µm
- Position accuracy : 3µm
Z-axis :
- Moving resolution : 0.1µm
- Repeatability : 1µm
Axis :