Packaging assembly laboratory / Wafer Dicing / Stealth Dicer
Stealth Dicing Disco DFL7340
Supplier :
Disco
Model :
DFL7340
Purpose :
Laser Stealth dicing of Si wafers
Applications field :
- Contact-less dicing of Silicon wafers
- PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing
Specifications :
- Fully automated mode
- Process Wavelength: IR
- 200mm wafers or smaller (6in, 4in, 3in, coupon, wafer quarter)
- Up to 1.5 mm thick wafers
- Multi-projects wafers (MPW) dicing capabilities
- IR camera for back side alignment
- X-axis & Y-axis:
- Feeding speed: 1.0 – 1000 mm/s
- Position accuracy: 3µm
