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Tescan Feras 3XM

Analytical laboratory / Microsectioning / Plasma FIB

Tescan Feras 3XM

Supplier :

Model :

Purpose :

Micro machining with a high performance Xenon focus ion beam coupled with a SEM for real time imaging of the cut.

CAPABILITY:

Tescan Mira-3 High Resolution Schottky Field Emission Scanning Electron Microscope (FESEM) Column

Fully integrated Orsay Physics Plasma Xe source Focused Ion Beam(FIB) column

MultiGIS Gas Injection System for Pt deposition

Tescan Wide Field Optics 3-lens electron optics, providing dedicated scanning and imaging modes for High Resolution, Wide Field ultra-low “macro” imaging, High Depth of Focus Imaging, live 3D stereo imaging, and selected area electron channeling (crystallographic) imaging from grains down to 20 μm.

200V – 30kV Accelerating Voltage range in 10V steps

High resolution imaging, 1.2 nm at 30 kV (SE), 2 nm at 30 kV (BSE)

Full 16-bit Image Acquisition and Scanning System, allowing acquisition of digital images up to 8, 192 x 8,192 pixels (64-Megapixels) with user-specified image aspect ratios of 1:1, 4:3 and 2:1

Ultra-wide FESEM magnification range from 2x to 1,000,000x

Large XM specimen chamber, 300mm x 330mm internal dim., 280mm x 310mm door opening, 11+ports

Heavy-duty 5-axis fully motorized and computer controlled specimen stage, x=130mm, y=130 mm, z=100mm, R=360˚, and tilt=-30˚ to + 90˚, Weight capacity =8Kg

Tescan Loadlock, fully integrated into the automatic vacuum system of the microscope, minimum 80mm sample exchange

Fully Integrated Halcyonics Active Vibration Cancellation System

Fully automatic vacuum system including a clean 2-stage turbomolecular pump with magnetic high vacuum bearings and a completely dry, lubricant-free scroll pump

Evehart-Thornley Secondary Electron Detector with single-Crystal Yag scintillator

To obtain more information about this equipment, email us !

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