Yield Engineering – YES PBV200 Vertacure

Yield Engineering – YES PBV200 Vertacure

Integrated microsystems laboratory (MEMS) / Lithography / Hard Bake

Yield Engineering – YES PBV200 Vertacure

Supplier :

Model :

Purpose :

Anneal/Bake/Cure under controlled temperature and sub-atmospheric pressure

CAPABILITY

Wafer size: 200 mm

Production wafers per load: 50

Thickness range of wafers: 300 – 1700 µm

Temperature range:  20 – 450 °C

Pressure range: 0.1 – 500 Torr

Gases used: Oxygen, Nitrogen, Forming gas (H2 4% and N2 96%)

Wafer material: Silicon, Glass, Bonded wafers

Processes:

  • Photo-resist bake processes
  • Polymer curing processes
  • Wafer dehydration processes
  • Wafer film sublimation processes
  • Glass-frit glaze cycles
  • Thin film resistors thermal treatments

To obtain more information about this equipment, email us !

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