Finetech Fineplacer® femto provides advanced packaging capabilities at C2MI

Finetech Fineplacer® femto provides advanced packaging capabilities at C2MI

Gilbert, Az and Bromont, Quebec (August 20, 2013) – Finetech, a global supplier of micro-assembly equipment and the MiQro Innovation Collaborative Centre (C2MI) located in Bromont, Québec, Canada, today announced that C2MI has installed a FINEPLACER® femto bonding system in its advanced packaging sector.

This automated, sub-micron accuracy system is designed to position and attach small electronic or opto-electronic components on printed circuit boards or substrates.<--break->

C2MI, as a Centre of Excellence, provides a state-of-the-art infrastructure for the benefits of its members. This high-technology hub provides support so that innovative concepts can be promptly commercialized. C2MI is active in die-level packaging, complex microsystems, 3D design integration and micro electromechanical systems (MEMS) development.

With a wide base of systems installed at many prestigious institutions and research centers, Finetech‘s die bonders provide unmatched solutions for advanced technology environments utilizing diverse applications. The FINEPLACER femto is a fully automated, sub-micron bonding platform that is ideal for product and process development of laser diodes, laser bars, VCSELs, photo diodes, sensors, LED bonding, MEMs, flip chip and micro optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, Indium, eutectic).

About Finetech

Finetech is a leading manufacturer of equipment for manual and fully automatic component rework and high-precision bonding and die attach. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research. Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions. Corporate headquarters and main production are in Berlin, Germany. Sales and Technical support centers are located in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia. Visit www.finetechusa.com.

About the MiQro Innovation Collaborative Centre

The MiQro Innovation Collaborative Centre (C2MI) is an international reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR) whose role is to help produce market-driven prototypes in the fields of applications of the information and communication technologies, automobile, aerospace as well as environment and health to accelerate their commercialization. The establishment of C2MI was made possible by contributions from Industry Canada, the ministère du Développement économique, de l’Innovation et de l’Exportation du Québec, Université de Sherbrooke, industrial partners and the Town of Bromont. Visit www.c2mi.ca.

-30-

Company Contact:
Adrienne Gerard
Finetech USA
Tel: +1 480-893-1630
E-Mail: adg@finetechusa.com

Company Contact:
Vincent Fortin
C2MI
Tel: +1 450-534-8000
E-Mail: vincent.fortin@c2mi.ca

Media Contact:
Amy Smith
Impress Labs
Tel: +1 401 369 9266
E-Mail:amy@impresslabs.com

 

Back to news list >