The C2MI has recently acquired the new capability of doing capillary wedge-to-wedge wire bonding on its K&S Iconn PoCu Plus LA equipment. This type of interconnection process is ideal for thermally sensible devices or the necessity for a small footprint, because it is achieved at room temperature and attains a smaller footprint on pads than the ball bonding connection type. This process is available both in aluminum and gold wire.
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