Heller 2017 MKIII

Heller 2017 MKIII

Laboratoire d'assemblage de semi-conducteurs / Positionnement des composantes / Fournaise de soudure

Heller 2017 MKIII

Fournisseur :

Modèle :

Fonction :

Reflow lead free solder join (C4) between the chip and the substrate

CAPABILITY: 

100% forced convection reflow oven

17 heating zones, 170 inches of heating

34 independent temperature controllers

Temperature gradient between heating zone over 50 C

3 cooling zones, 30 in. of cooling

Belt width 12 in.

Process clearance above belt  2 in.

Conveyor speed 2 to 50 in./min

Nitrogen flow controller 200 to 1200 SCFH/section

Max  50 ppm oxygen and moisture

Mass flow and blower speed,  software controlled

Nitrogen curtain entrance and exit

Accuracy of temperature controller +/- 0.5 C

Cross belt temperature control +/- 3 C

5 thermocouples real time profiling

Live monitoring system  (KIC 24/7)

Max temperature up to 400 C in heated zones

Blower speed rotation adjustment and alarm

Power lift hood

UPS back up

Pour obtenir plus d'information sur cet équipement, rejoignez-nous par courriel!

RECHERCHE

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