Laboratoire d'assemblage de semi-conducteurs / Positionnement des composantes / Fournaise de soudure
Heller 2017 MKIII
Fournisseur :
Modèle :
Fonction :
Reflow lead free solder join (C4) between the chip and the substrate
CAPABILITY:
100% forced convection reflow oven
17 heating zones, 170 inches of heating
34 independent temperature controllers
Temperature gradient between heating zone over 50 C
3 cooling zones, 30 in. of cooling
Belt width 12 in.
Process clearance above belt 2 in.
Conveyor speed 2 to 50 in./min
Nitrogen flow controller 200 to 1200 SCFH/section
Max 50 ppm oxygen and moisture
Mass flow and blower speed, software controlled
Nitrogen curtain entrance and exit
Accuracy of temperature controller +/- 0.5 C
Cross belt temperature control +/- 3 C
5 thermocouples real time profiling
Live monitoring system (KIC 24/7)
Max temperature up to 400 C in heated zones
Blower speed rotation adjustment and alarm
Power lift hood
UPS back up