Integrated microsystems laboratory (MEMS) / Lift-off / Dry lift-off and detaping
Electronic SRL Leonardo 300LO
Supplier :
Model :
Purpose :
Dry lift-off and detaping processes
CAPABILITY:
Wafer size: 200 mm
Thickness range of wafers: 300 – 1200 µm
Wafer material: Silicon, Glass, Bonded wafers
Processes:
- Dry lift-off of metal layers (SAES Getters and Au) deposited on PerMX type material
- Protection tape removal
