Disco DFD 6362

Disco DFD 6362

Packaging assembly laboratory / Wafer Dicing / Wafer Dicing

Disco DFD 6362

Supplier :

Model :

Purpose :

Cut wafer at various chip size

CAPACITY:

Irregular slices up to 300mm with solder balls or wire solder site

Slices of glass, ceramics, overlays, SiC, Sapphire, etc.

Edge cutting function

Integrated automatic options :

CO2 injector
Washing station
UV exposure

High-speed rotation up to 2.2kW/80K RPM

2-inch blade hub or hubless blade

Positioning accuracy: 4µm

Standard cassette 10 slot 300 mm /frame FF123

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