CAPABILITY: Film thickness: 300 ± 30 nm, and 2000 ± 200 nm Within wafer thickness non-uniformity: 2.5% (1 sigma) Wafer-to-wafer
CAPABILITY: Film thickness: 300 ± 30 nm, and 2000 ± 200 nm Within wafer thickness non-uniformity: 2.5% (1 sigma) Wafer-to-wafer