CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating

CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,

CAPABILITY:  Semi-Automatic equipment Automatic alignment of substrate position and dispense Manually load/unload substrate on the dispense stage Substrate: min size

CAPABILITY: Input/output Jedec tray Multiple axes (Cartesian) gantry system with two independents heads. X-Y placement accuracy +/- 50 µm Encoder