CAPACITY:  200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage

Stealth dicing is a laser-based technique to dice silicon wafers. This technique has several benefits. Among others, it’s a dry

CAPACITY: Irregular slices up to 300mm with solder balls or wire solder site Slices of glass, ceramics, overlays, SiC, Sapphire,