Applications field : Wafer edge grinding Wafer terrace bevelling Wafer coring post processing of edges   Specifications Fully automated mode

CAPACITY:  200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage

CAPACITY: Irregular slices up to 300mm with solder balls or wire solder site Slices of glass, ceramics, overlays, SiC, Sapphire,