CAPABILITY:

Ultra-thin automated wafer handling

Automatic peeling and dicing frame  (FF123) mounting

Chemical/Mechanical polishing station  0.15 µm roughness

TTV  without device protection tape and resist film 2.5 µm

Non-contact probe for thickness measurement

Cleanliness:, chuck cleaning, pre/post BG tape cleaning

Wafer handling hand and pad cleaning

Wafer mounting accuracy for centering  within  0.5 mm

Notch accuracy  for  dicing frame within 0.5 deg