Application fields:

• 8in wafer compression molding equipment for Fan-out wafer-level packaging (FOWLP) and heterogeneous integration
• Molding of reconstituted wafers (D2W)
• The system is manual, ideal for high-mix variable-volume production and prototype evaluation

Specifications :

• It supports wafer molding of 8 inches (Φ197 mm).
• Substrate integration: Silicon, glass, III-V materials, CMOS
• Original Cavity Down Structure: Enables stable, high-quality molding by controlling resin flow and mold pressure precisely.
• Vacuum Assistance (High Vacuum “FM” Method): Removes air, gas, and moisture from the mold cavity before curing to reduce voids and improve package quality.
• Can allow various liquid, sheet or granular molding compounds
• Temperature, and pressure profiles during process to control final thickness and warp