Packaging assembly laboratory / Wafer Dicing / Wafer Dicing
Edge Grinder
Supplier :
Daitron
Model :
WBM 2100A
Purpose :
Wafer edge grinding
Applications field :
- Wafer edge grinding
- Wafer terrace bevelling
- Wafer coring post processing of edges
Specifications
- Fully automated mode
- Edge Type :
- C-shape, T-shape
- Terrace Bevelling, (22/45 Deg)
- Wafer Type/sizes :
- 200mm, 150mm, 4in, 3in
- Blanket Si or CMOS
- Notch types :
- Notch
- Optical flat
