Applications field:

The VSS-300 is a vacuum reflow soldering oven designed for:

• Reflow soldering processes with or without vacuum (up to 10⁻⁶ hPa).
• Operation with flux, inert gas (N₂), ambient air or formic acid.
• Prototyping, process development, small batch and pre-series production

Specifications:

• Fast and uniform thermal control (≥150 K/min ramp, ±1 % uniformity)
• Fully programable (up to 50 steps) with data logging
• Temperature range: up to 450 °C
• Process environment: high vacuum or inert gas (N₂)
• Pressure control: high precision, configurable
• Thermal uniformity: ≤1 % of setpoint (e.g. ±3 K @ 300 °C)
• Usable area: 300 mm x 300 mm
• Soldering methods: vacuum soldering, gas reflow, Ag sintering