Applications field:

• Photonics: assembly of optical and photonic components (lasers, detectors, optical modules).
• Microelectronics: integration of semiconductors, MEMS, and hybrid circuits.
• Communication & RF: packaging of devices for telecommunications and high-frequency systems.
• Aerospace & Defense: assembly of critical modules requiring reliability and precision.
• Research & Development: rapid prototyping and process qualification.

Flexible development with high accuracy:

• Sub-5 µm placement accuracy (Glass die on Glass substrate)
• Vision cameras (Top, bottom)
• Supports eutectic, epoxy, and adhesive die attach processes
  • Two dispensing heads
  • Dipping and stamping
• 360° rotating pick-tip with pressure feedback
  • Ability to store up to 26 placement and stamping tools in the machine
• Capable of handling a wide range of die sizes, materials, and package types
• In-situ UV curing